Old Web
English
Sign In
Acemap
>
authorDetail
>
Ki-Young Yun
Ki-Young Yun
Samsung
Materials science
Electronic engineering
Silicon
Extrusion
Composite material
4
Papers
47
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
TSV optimization for BEOL interconnection in logic process
2012
DIC | IEEE International D Systems Integration Conference
Sin-Woo Kang
Sung-Dong Cho
Ki-Young Yun
Sangwook Ji
Kisoon Bae
Woon-Seob Lee
Eun-ji Kim
Jang-ho Kim
Jonghoon Cho
Hyongyol Mun
Yeong L. Park
Show All
Source
Cite
Save
Citations (21)
Annealing process and structural considerations in controlling extrusion-type defects Cu TSV
2012
IITC | International Interconnect Technology Conference
Jin-ho An
Kwang-jin Moon
So-Young Lee
Do-Sun Lee
Ki-Young Yun
Byung-lyul Park
Ho-Jun Lee
Jiwoong Sue
Yeong-lyeol Park
Gil-heyun Choi
Ho Kyu Kang
Chilhee Chung
Show All
Source
Cite
Save
Citations (10)
Impact of TSV proximity on 45nm CMOS devices in wafer level
2011
IITC | International Interconnect Technology Conference
Sung-Dong Cho
Sin-Woo Kang
Kang-Wook Park
Jae-Chul Kim
Ki-Young Yun
Kisoon Bae
Woon-Seob Lee
Sangwook Ji
Eun-ji Kim
Jang-ho Kim
Yeong L. Park
Eun Seung Jung
Show All
Source
Cite
Save
Citations (13)
1