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M.N. Jawaid
M.N. Jawaid
Adhesion
Wafer
Silicon
Nickel
Screen printing
2
Papers
83
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Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel–copper contacts on silicon solar cells
2013
Solar Energy Materials and Solar Cells
A. Mondon
M.N. Jawaid
Jonas Bartsch
Markus Glatthaar
Stefan W. Glunz
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Citations (69)
Progress with Multi-Step Metallization Processes Featuring Copper as Conducting Layer at Fraunhofer ISE
2012
PEC | World Conference on Photovoltaic Energy Conversion
Stefan W. Glunz
Markus Glatthaar
C. Schetter
Florian Clement
Andreas Lorenz
M.N. Jawaid
N. Wehkamp
M Mehling
M.D. Wendling
Achim Kraft
Mathias Kamp
A. Mondon
Jonas Bartsch
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Citations (14)
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