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M. Mermet-Guyennet
M. Mermet-Guyennet
STMicroelectronics
Chip-scale package
Very-large-scale integration
Passivation
Integrated circuit
Integrated circuit packaging
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Plastic package related effects, measured by means of silicon test patterns
1990
R. Tiziani
M. Mermet-Guyennet
V. Motta
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