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Weng Zhangzhao
Weng Zhangzhao
Nuclear magnetic resonance
Materials science
Metallurgy
Engineering physics
Flip chip
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Destructive Physical Analysis Methods of Flip Chip Packaging Devices for High Reliability
2021
ICEPT | International Conference on Electronic Packaging Technology
Zhou Shuai
Weng Zhangzhao
Qiu Baojun
Luo Daojun
Wang Xiaoqiang
Ma Kaixue
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