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Winston Shue
Winston Shue
TSMC
Physics
Optoelectronics
Electronic engineering
Electromigration
Leakage (electronics)
5
Papers
51
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The Overview of Current Interconnect Technology Challenges and Future Opportunities
2020
IEDM | International Electron Devices Meeting
M.H. Lee
Winston Shue
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Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking
2009
IEDM | International Electron Devices Meeting
D.Y. Chen
W.C. Chiou
M.F. Chen
T.D. Wang
K.M. Ching
H.J. Tu
W.J. Wu
C.L. Yu
Kuo-Nan Yang
H. B. Chang
M.H. Tseng
Ching-Wen Hsiao
Y.J. Lu
H.P. Hu
You-Ru Lin
C.S. Hsu
Winston Shue
Chung-Yi Yu
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Citations (38)
Electrochemical Evolution for 45 nm-node Technology and Beyond
2006
Chien Hsueh Shih
Ming-Hsin Tsai
Winston Shue
Chen-Hua Yu
Mong-Song Liang
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Direct plating of Cu on ALD TaN for 45nm node Cu BEOL metallization
2004
IEDM | International Electron Devices Meeting
C. H Shih
H W Su
C.-J. Lin
T. Ko
C-H. Chen
J.J. Huang
S.-W. Chou
C.H. Peng
C. H. Hsieh
M.-H. Tsai
Winston Shue
C.H. Yu
M.S. Liang
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Citations (8)
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