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Bob Barr
Bob Barr
Dow Chemical Company
Materials science
Wafer
Wafer backgrinding
Wafer testing
Die preparation
5
Papers
17
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Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives
2015
David D. Fleming
Jong-Uk Kim
Janet Okada
Kevin Wang
Michael Gallagher
Bob Barr
Jeff Calvert
Kai Zoschke
Matthias Wegner
Michael Töpper
Thomas Rapps
Tim Griesbach
Stefan Lutter
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Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level Packaging
2015
Hua Dong
Greg Prokopowicz
Bob Barr
Joe Lachowski
Jeff Calvert
Mike Gallagher
Tina Aoude
Rosemary Bell
Sue McNamara
Masaki Kondoh
Joon-Seok Oh
David Louks
Jong-Uk Kim
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Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging
2014
Jong-Uk Kim
Anupam Choubey
Rosemary Bell
Hua Dong
Michael Gallagher
Joe Lachowski
Masaki Kondo
Corey OConnor
Greg Prokopowicz
Bob Barr
Dow Electronic Materials
Kai Zoschke
Matthias Wegner
Christina Lopper
Michael Toepper
Fraunhofer Izm
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In-line and vertical texturing of mono-crystalline solar cells
2010
PVSC | Photovoltaic Specialists Conference
M. Moynihan
Corey OConnor
Bob Barr
Scott Tiffany
Wolfgang Braun
George Allardyce
Jochen Rentsch
K. Birmann
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