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Yang Wan

Georgia Institute of Technology

5

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77

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Thermal impact study of block folding and face-to-face bonding in 3D IC

2015 IITC | International Interconnect Technology Conference
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3D IC power benefit study under practical design considerations

2015 IITC | International Interconnect Technology Conference
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On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective

2014 DAC | Design Automation Conference
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Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs

2013 ICCAD | International Conference on Computer Aided Design
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How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core

2013 CICC | Custom Integrated Circuits Conference
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