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S. Delachanal
S. Delachanal
Materials science
Optoelectronics
Electronic engineering
Silicon
Microelectromechanical systems
5
Papers
12
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0
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Out-of-Plane Comb-Fingers for a Low-Noise, 0.12-MM2 Z-Axis Accelerometer Fabricated with a 3D MEMS Process
2019
MEMS | International Conference on Micro Electro Mechanical Systems
F. Maspero
S. Delachanal
Audrey Berthelot
Loic Joet
Giacomo Langfelder
S. Hentz
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Small footprint, high-performance silicon capacitive accelerometer with a 3-D process
2018
MEMS | International Conference on Micro Electro Mechanical Systems
F. Maspero
S. Delachanal
Audrey Berthelot
L. Joet
Giacomo Langfelder
S. Hentz
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Citations (3)
Ultra-fine pitch redistribution for 3D interposer
2013
EMPC | European Microelectronics and Packaging Conference
R. Segaud
Christophe Aumont
R. Eleouet
N. Allouti
T. Mourier
Laurence Gabette
Stephane Minoret
Thomas Magis
A. Roman
R. Hida
C. Ratin
L. Lachal
S. Delachanal
M. L. Cordini
P. Nardi
H. Feldis
A. Charpentier
P. Chausse
C. Laviron
S. Cheramy
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Citations (1)
Ultra-fine pitch redistribution for 3D interposer
2013
EMPC | European Microelectronics and Packaging Conference
R. Segaud
Christophe Aumont
R. Eleouet
N. Allouti
T. Mourier
Laurence Gabette
Stephane Minoret
Thomas Magis
A. Roman
R. Hida
C. Ratin
L. Lachal
S. Delachanal
M. L. Cordini
P. Nardi
H. Feldis
A. Charpentier
P. Chausse
C. Laviron
S. Cheramy
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Citations (1)
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