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Toshifumi Kanno
Toshifumi Kanno
Kyoto University
Digital image correlation
Electronic engineering
Materials science
Finite element method
Strain (chemistry)
8
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9
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Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method
2013
Microelectronics Reliability
Toru Ikeda
Toshifumi Kanno
Nobuyuki Shishido
Noriyuki Miyazaki
Hiroyuki Tanaka
Takuya Hatao
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Citations (8)
An analysis of local deformation of SnAgCu solder joint using digital image correlation
2010
ICEPT | International Conference on Electronic Packaging Technology
Nobuyuki Shishido
Toshifumi Kanno
Shinya Kawahara
Toru Ikeda
Noriyuki Miyazaki
Hua Lu
C. Bailey
Owen Thomas
Davide Di Maio
Christopher Hunt
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Strain Measurement in Micro-Electronic Packages using the Digital Image Correlation Method
2010
Quarterly Journal of The Japan Welding Society
Toru Ikeda
Toshifumi Kanno
Nobuyuki Shishido
Noriyuki Miyazaki
Hiroyuki Tanaka
Takuya Hatao
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J0103-2-3 Evaluation of Thermal Fatigue Reliability of Solder Joints in Flip Chip Package using the Digital Image Correlation Method
2009
Toshifumi Kanno
Nobuyuki Shishido
Toru Ikeda
Noriyuki Miyazaki
Hiroyuki Tanaka
Takuya Hatao
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1502 Strain Measurement in Flip Chip Packages using the Digital Image Correlation Method and the Improvement of the FEM Analysis
2009
Toshifumi Kanno
Toru Ikeda
Noriyuki Miyazaki
Hiroyuki Tanaka
Takuya Hatao
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