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Gwangpyuk Suh
Gwangpyuk Suh
Samsung
Deposition (law)
Metallurgy
Dielectric
Materials science
Copper
1
Papers
6
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New insight into stress induced voiding mechanism in Cu interconnects
2005
IITC | International Interconnect Technology Conference
Sun-jung Lee
Soo-Geun Lee
Bong-Suk Suh
Hong-jae Shin
Nae-in Lee
Ho Kyu Kang
Gwangpyuk Suh
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Citations (6)
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