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Christine Ferrandon
Christine Ferrandon
Materials science
Electronic engineering
Electrical engineering
Wafer-level packaging
Insertion loss
2
Papers
31
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Silicon interposer: A versatile platform towards full-3D integration of wireless systems at millimeter-wave frequencies
2015
ECTC | Electronic Components and Technology Conference
Ossama El Bouayadi
Laurent Dussopt
Yann Lamy
Cedric Dehos
Christine Ferrandon
Alexandre Siligaris
Brigitte Soulier
G. Simon
Pierre Vincent
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Citations (17)
A fully packaged piezoelectric switch with lowvoltage actuation and electrostatic hold
2010
MEMS | International Conference on Micro Electro Mechanical Systems
M. Cueff
Emmanuel Defay
Patrice Rey
Gwenael Le Rhun
François Perruchot
Christine Ferrandon
D. Mercier
Frederic Domingue
A. Suhm
M. Aïd
Lianjiu Liu
Sergio Pacheco
Mel Miller
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Citations (14)
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