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S. C. O. Mathuna
S. C. O. Mathuna
University College Cork
Electronic engineering
Engineering
Integrated circuit packaging
Calibration
Thermal resistance
7
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73
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New Integrated Planar Magnetic Cores for Inductors and Transformers Fabricated in MCM-L Technology
1999
S OReilly
Maeve Duffy
Terence ODonnell
S. C. O. Mathuna
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Citations (12)
New Integrated Planar Magnetic Cores for Inductors and Transformers Fabricated in MCM-L Technology
1999
S. O'Reilly
Maeve Duffy
Terence O’Donnell
S. C. O. Mathuna
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Thermal characterisation of vertical multichip modules MCM-V
1995
SEMI-THERM | Semiconductor Thermal Measurement and Management Symposium
C. Cahill
A. Compagno
J O'Donovan
Orla Slattery
S. C. O. Mathuna
J. Barrett
I. Serthelon
C. Val
J.-P. Tigners
J.M. Stern
Peter A. Ivey
M. Masgrangeas
A. Coello Vera
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Citations (16)
Development and application of test chips and test systems for the thermal characteristics of IC packaging technologies
1992
SEMI-THERM | Semiconductor Thermal Measurement and Management Symposium
S. C. O. Mathuna
Liu Daguang
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Citations (13)
Imaging of Integrated Circuit Packaging Technologies Using Scanning Acoustic Microscopy
1992
J. Flannery
G. M. Crean
S. C. O. Mathuna
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Citations (3)
1