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M. Simeus
M. Simeus
Manufacturing engineering
Environmental tests
Government
Embedded system
Flip chip
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2024
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Assembly and Cleaning of CSPs for High, Low, and UltraLow Volume Applications
2000
R. Ghaffarian
A Mehta
J. Bonner
C. Achong
O Vogler
D. Phillips
A. Celestica
M Mehrotra
M. Simeus
S. Stegura
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