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Jeff Lin
Jeff Lin
Xilinx
Chip-scale package
Electronic engineering
Field-programmable gate array
Embedded system
Interposer
2
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29
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A comprehensive reliability study on a CoWoS 3D IC package
2015
ECTC | Electronic Components and Technology Conference
Ganesh Hariharan
Raghunandan Chaware
Inderjit Singh
Jeff Lin
Laurene Yip
Kenny Ng
Sy Pai
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Citations (14)
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