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Soon-Jin Cho

KAIST

5

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53

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Studies on double-layered metal bumps for fine pitch flip chip applications

2005
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The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound

1997 IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
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Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion

1996
- Soon-Jin Cho
- Kyung-Wook Paik
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Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion

1996
- Soon-Jin Cho
- Kyung-Wook Paik
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