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Rak-Hwan Kim
Rak-Hwan Kim
Samsung
Inorganic chemistry
Nitrogen
Metal
Materials science
Composite material
3
Papers
7
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0
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The via resistance analysis at ALD-to-PVD TaN transition layer
2021
IITC | International Interconnect Technology Conference
Young Soo Yoon
Chang-Hyun Kim
Junki Jang
Kichang Sung
Hoon Kim
Yun-Ki Choi
Jeong-Hoon Ahn
Wonkyu Han
Woojin Jang
Rak-Hwan Kim
Dongwoo Shin
Ju-Heon Kim
Youngju Lim
Hyunju Yim
Wonmo Kang
Jong-Mil Youn
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Electromigration Characteristics and Morphological Evolution of Cu Interconnects on CVD Co and Ru Liners for 10-nm Class VLSI Technology
2018
IEEE Electron Device Letters
Kyung-Tae Jang
So-Yeon Lee
Sekwon Na
Sol Kyu Lee
Jong-Min Baek
Wookyung You
OkHee Park
Rak-Hwan Kim
Hyeok-Sang Oh
Young-Chang Joo
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Citations (7)
A method for forming metal nitride films in contact openings and integrated circuit layers formed in this way
2005
Gil-heyun Choi
Kyung In Choi
Sung-ho Han
Rak-Hwan Kim
Sang-Woo Lee
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