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Betty Phillips
Betty Phillips
Intel
Printed circuit board
Engineering
Finite element method
Deflection (engineering)
Mobile device
4
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36
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Handheld use condition-based bend test development
2006
IEEE Transactions on Advanced Packaging
Lei L. Mercado
Betty Phillips
Shubhada H. Sahasrabudhe
J.P. Sedillo
D Bray
E. Monroe
Kang Joon Lee
George Lo
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Citations (7)
The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages
2005
Kayleen L. E. Helms
Betty Phillips
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Citations (3)
Use-Conditions-Based Board Level Shock Test Development for Handheld Components
2004
Shubhada H. Sahasrabudhe
Vinayak Pandey
Betty Phillips
Kang Joon Lee
Lei L. Mercado
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