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Erh-Hao Chen

Industrial Technology Research Institute

7

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Low-cost 3DIC process technologies for wide-I/O memory cube

2015 VLSI-TSA | International Symposium on VLSI Technology, Systems, and Applications
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Technologies and challenges of fine-pitch backside via-last 3DIC TSV process integration and its electrical characteristics and system applications

2014 VLSIT | Symposium on VLSI Technology
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Study of TSV filling performance with wide-range pattern densities by using a novel plating chamber with surface paddle agitation

2013 VLSIT | Symposium on VLSI Technology
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