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Harald Kuhn
Harald Kuhn
Fraunhofer Society
Materials science
Quantum dot
Wafer bonding
Wafer
Optoelectronics
4
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Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems
2021
ECS Journal of Solid State Science and Technology
Franz Selbmann
Mario Baum
Christoph Meinecke
Maik Wiemer
Harald Kuhn
Yvonne Joseph
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Reactive chip level bonding based on CuO/Al reactive multilayer systems
2021
EMPC | European Microelectronics and Packaging Conference
Klaus Vogel
Ralph Schachler
Frank Roscher
Maik Wiemer
Harald Kuhn
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Investigating the Dynamics of Quantum Dot based Light-emitting Diodes with different emission wavelength
2021
Joern Langenickel
Alexander Weis
Joerg Martin
Thomas Otto
Harald Kuhn
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Bridging the gap: Perspectives of nanofabrication technologies for application-oriented research
2021
Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
Mario Baum
Christoph Meinecke
Thomas Blaudeck
Christian Helke
Danny Reuter
Karla Hiller
Sascha Hermann
Stefan E. Schulz
Harald Kuhn
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