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Douglas O. Powell
Douglas O. Powell
IBM
Materials science
Composite material
Flip chip
Electronic engineering
Soldering
4
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49
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Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
2013
ECTC | Electronic Components and Technology Conference
Kang-Wook Lee
Stephane Barbeau
Francois Racicot
Douglas O. Powell
Charles L. Arvin
Thomas A. Wassick
Joseph C. Ross
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Method for selectively adhering solder to circuit package
1996
Charles F. Carey
Kenneth Michael Fallon
Voya R. Markovich
Douglas O. Powell
Gary Paul Vlasak
Richard Stuart Zarr
kenisu maikeru fu a ron
gerii pooru burasakku
dagurasu oribaa paueru
tyaaruzu furansisu kearii
boya risuta marukobitti
rityaado sutyuaato zaaru
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