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Joachim N. Burghartz

Delft University of Technology
IBM

340

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6384

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Hybrid Systems-in-Foil

2021
- Mourad Elsobky
- Joachim N. Burghartz
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Flexible Ultra-Thin Chip-Film Patch for Integration of Electronic Components for Biomedical Applications

2021
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3D Integrated 300°C Tunable RF Oscillator exploiting AlGaN/GaN HEMT for High Temperature Applications

2021 IMS | International Microwave Symposium
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A Flexible Chip-Film Patch and a Flexible Strain Gauge Sensor Suitable for a Hybrid Systems-in-Foil Integration

2021 IEEE Sensors Journal
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Ultra-thin Image Sensor Chip Embeded Foil

2021
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Backside Illuminated “Ge-on-Si” NIR Camera

2021 IEEE Sensors Journal
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Multidimensional process optimization of a negative e-beam photoresist for silicon-waveguide manufacturing

2021
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Model and Simulation of GaN-Based Pressure Sensors for High Temperature Applications—Part I: Physics Based Compact Modeling

2021 IEEE Sensors Journal
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Model and Simulation of GaN-Based Pressure Sensors for High Temperature Applications—Part II: Sensor Design and Simulation

2021 IEEE Sensors Journal
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A 12-to-15 b, 100-to-25 kS/s Resolution Reconfigurable, Power Scalable Incremental ADC using Ultra-Thin Chips

2021 SENSORS | IEEE Sensors
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