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N.V. Rogozin
N.V. Rogozin
Flip chip
Packaging engineering
Semiconductor
Optoelectronics
Die (manufacturing)
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PLATINUM METALLIZATION IN SEMICONDUCTOR DIES CONTACT PADS REDISTRIBUTION SYSTEM FOR THE «FLIP-CHIP» DIE PACKAGING TECHNOLOGY
2019
V.V. Pobedinsky
N.V. Rogozin
E. N. Bormontov
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