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A. LaManna
A. LaManna
Katholieke Universiteit Leuven
Wafer
Stacking
Flip chip
Stack (abstract data type)
cost effectiveness
3
Papers
15
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Underfill material screening and process characterization for 3D stacking
2012
Electronics System-integration Technology Conference
Kenneth June Rebibis
A. LaManna
C. Gerets
Teng Wang
R. Daily
Giovanni Capuz
Andy Miller
Eric Beyne
Bart Swinnen
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Citations (3)
Wafer applied and no flow underfill screening for 3D stacks
2012
EPTC | Electronics Packaging Technology Conference
Kenneth June Rebibis
C. Gerets
Giovanni Capuz
R. Daily
Teng Wang
A. LaManna
Fabrice Duval
Andy Miller
R. Guino
R. Peddi
Eric Beyne
Bart Swinnen
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Citations (6)
1