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A. Kloeser
A. Kloeser
Chip
chip size
Metallurgy
Composite material
Materials science
3
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46
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Chip Size Package - The Option of Choice for Miniaturized Medical Devices
1998
Michael Toepper
C. Karduck
C. Meinherz
L. Hoster
P. Coskina
Herbert Reichl
M. Schaldach
S. Fehlberg
K. Heinricht
V. Bader
A. Kloeser
Oswin Ehrmann
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Citations (17)
Chip size package : The option of choice for miniaturized medical devices
1998
M Topper
M. Schaldach
S. Fehlberg
C. Karduck
C. Meinherz
K. Heinricht
V. Bader
L. Hoster
P. Coskina
A. Kloeser
O. Ehrmann
Herbert Reichl
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Citations (18)
Fluxless Flip‐chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering*
1996
Soldering & Surface Mount Technology
Rolf Aschenbrenner
Elke Zakel
Ghassem Azdasht
A. Kloeser
Herbert Reichl
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Citations (11)
1