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I. Gershman
I. Gershman
Bar-Ilan University
Quad Flat No-leads package
Ohmic Resistance
Engineering
Reliability engineering
Structural health monitoring
2
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14
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Structural health monitoring of solder joints in QFN package
2012
Microelectronics Reliability
I. Gershman
Joseph B. Bernstein
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Citations (14)
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