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kan tugi murakami
kan tugi murakami
Materials science
Printed circuit board
Copper plating
Copper oxide
Inorganic chemistry
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無電解銅めっき液、その管理方法、及び無電解銅めっき装置
2002
Haruo Akaboshi
Satoshi Akazawa
Yuko Arai
Katsumi Mabuchi
Tokuyuki Masuyama
Kanji Murakami
Masahiro Suzuki
Hisao Takano
noriyuki masuyama
yuuko arai
kan tugi murakami
haruo akabosi
satosi akazawa
masahiro suzuki
katumi mabuti
hisao takano
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Electroless gold plating solution and an electroless gold plating method
2001
sumiko nakazima
hirosi yamamoto
kan tugi murakami
kiyosi hasegawa
akio takahasi
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Resin filling method for printed wiring board
1992
Kanji Murakami
Haruo Ogino
kan tugi murakami
haruo ogino
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アディティブ法プリント配線板の高機能化 (最新プリント配線板の高機能化技法--EMI対策,高耐熱,低膨張率,低誘電率化を中心に )
1989
Electronic engineering
kan tugi murakami
haruo akabosi
mineo kawamoto
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Circuit formation method
1987
mineo kawamoto
kan tugi murakami
ritu tukasa toba
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アディティブ法配線板 (プリント配線板のすべて--高速・高密度化への対応) -- (各種配線板の特徴)
1984
Electronic engineering
moto yo wazima
kan tugi murakami
kane osamu kawakubo
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