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Thomas Werner
Thomas Werner
Advanced Micro Devices
Electronic engineering
Engineering
Materials science
Wafer
test structure
6
Papers
17
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SOI and low-K in high-volume manufacturing
2004
D. Greenlaw
Gert Burbach
Thomas Feudel
Frank Feustel
Kai Frohberg
Falk Graetsch
Gunter Grasshoff
Carsten Hartig
K. Hempel
Manfred Horstmann
Peter Huebler
R. Kirsch
Stephan Kruegel
E. Langer
A. Pawlowitsch
Hartmut Ruelke
Holger Schuehrer
Rolf Stephan
Andy Wei
Thomas Werner
Karsten Wieczorek
Michael Raab
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Taking SOI substrates and low-k dielectrics into high-volume microprocessor production
2003
IEDM | International Electron Devices Meeting
D. Greenlaw
Gert Burbach
Thomas Feudel
Frank Feustel
Kai Frohberg
Falk Graetsch
Gunter Grasshoff
Carsten Hartig
Thomas Heller
K. Hempel
Manfred Horstmann
Peter Huebler
R. Kirsch
Stephan Kruegel
E. Langer
A. Pawlowitsch
Hartmut Ruelke
Holger Schuehrer
Rolf Stephan
Andy Wei
Thomas Werner
Karsten Wieczorek
Michael Raab
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Monitoring the void formation in a process Damascence
2001
Peter Hübler
Frank Koschinsky
Thomas Werner
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A chip-surface alignment structure
2001
Gunter Grasshoff
Carsten Hartig
Bernd Schulz
Thomas Werner
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Extending the limits of i-line lithography for via layers and minimization of dense-iso bias
1999
Ramkumar Subramanian
Christopher A. Spence
Luigi Capodieci
Thomas Werner
Ernesto Gallardo
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