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Wei Zhen Goh
Wei Zhen Goh
STMicroelectronics
Automotive engineering
Electronic engineering
Materials science
Chip-scale package
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Enhance TCOB life for wafer level package with a new leadfree solder alloy
2015
EPTC | Electronics Packaging Technology Conference
Xueren Zhang
Wei Zhen Goh
Kim-sing Wong
Daniel Yap
Kim-yong Goh
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