Old Web
English
Sign In
Acemap
>
authorDetail
>
Gooi Boon Hooi
Gooi Boon Hooi
Spansion
Corrosion
Composite material
Anode
Soldering
Galvanic corrosion
1
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Improved humidity resistance of leaded packages through solder dip process
2011
ICEPT | International Conference on Electronic Packaging Technology
Yeoh Lai Seng
Law Che Seong
Ng Eng Keat
Gooi Boon Hooi
F. C. Classe
Susan Li
Show All
Source
Cite
Save
Citations (0)
1