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D.Y. Shu
D.Y. Shu
Materials science
Composite material
Microstructure
Metallurgy
Extrusion
7
Papers
22
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Numerical simulation to determine the shaped charge jet-slug interface
2020
Y. D. Jing
Q. Chen
B. Chang
B Xue
Ch Tang
D.Y. Shu
F.W. Liu
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Assessment of Cold Extrusion Effect on Stress–Strain Curves of Pure Copper Arc Parts Based on the Cosine Velocity Model
2019
Strength of Materials
S.H. Huang
Y. Wu
X.S. Xia
Z.D. Zhao
Q. Chen
D.Y. Shu
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Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing
2017
Journal of Materials Science & Technology
Q. Chen
D.Y. Shu
J Lin
Y. Wu
X.S. Xia
S.H. Huang
Z.D. Zhao
O.V. Mishin
G.L. Wu
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Citations (16)
12 Inch bumpless Wafer-On-Wafer (WOW) fully integrated 3DIC process
2011
Sue-Chen Liao
Chun-Hsiung Lin
P-J Tzeng
Jui-Chin Chen
Shang-Chun Chen
Chunyan Wu
Chien-Chou Chen
Y. C. Hsin
Y.F. Hsu
S.H.Shen
C-H. Chen
Changwon Wang
D.Y. Shu
T. C. Hsu
C.H. Ho
Tzu-Kun Ku
Ming-Jer Kao
Young Suk Kim
Hideki Kitada
Nobuhide Maeda
Koji Fujimoto
Shoichi Kodama
Takayuki Ohba
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In-line inspection on thickness of sputtered HfO/sub 2/ and Hf metal ultra-thin films by spectroscopic ellipsometry
2004
Y. Chuo
D.Y. Shu
L.S. Lee
W.Y. Hsieh
M.-J. Tsai
A. Wang
S.B. Hung
P-J Tzeng
Y.W. Chou
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