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Seongkuk Lee
Seongkuk Lee
SUSS MicroTec
Materials science
Optoelectronics
Excimer laser
Wafer-level packaging
Laser ablation
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Innovative laser enabled dual damascene process for ultra-fine line multi-layer routing for advanced packaging
2017
ICEP | International Conference on Electronics Packaging
Habib Hichri
Seongkuk Lee
Markus Arendt
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