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Shenghua Huang
Shenghua Huang
SanDisk
Temperature cycling
Stack (abstract data type)
EMI
Composite material
Flash memory
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Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test
2021
Microelectronics Reliability
Yangming Liu
Bo Yang
Shenghua Huang
Xu Wang
Ning Ye
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