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Akihito Takano
Akihito Takano
Taiyo Yuden
Electronic engineering
Materials science
Interposer
Composite material
Silicon
5
Papers
77
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Evaluation of Mechanical Stress Induced During IC Packaging
2018
ECTC | Electronic Components and Technology Conference
Vladimir Cherman
Melina Lofrano
Mario Gonzalez
Francisco Cadacio
Kenneth June Rebibis
Eric Beyne
Akihito Takano
Mitsutoshi Higashi
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Citations (6)
Cost and performance effective silicon interposer and Vertical Interconnect for 3D ASIC and memory integration
2014
ECTC | Electronic Components and Technology Conference
Li Li
Mitsutoshi Higashi
Akihito Takano
Jie Xue
Gary Ikari
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Development of Si interposer with low inductance decoupling capacitor
2011
Electronic Components and Technology Conference
Akihito Takano
Masahiro Sunohara
Mitsutoshi Higashi
Ichiro Hayakawa
Ken-ichi Ohta
Yuichi Sasajima
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Citations (3)
Development of Si interposer with low inductance decoupling capacitor
2011
ECTC | Electronic Components and Technology Conference
Akihito Takano
Masahiro Sunohara
Mitsutoshi Higashi
Ichiro Hayakawa
Ken-ichi Ohta
Yuichi Sasajima
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Citations (14)
Studies on electrical performance and thermal stress of a silicon interposer with TSVs
2010
ECTC | Electronic Components and Technology Conference
Masahiro Sunohara
Hideaki Sakaguchi
Akihito Takano
Rie Arai
Kei Murayama
Mitsutoshi Higashi
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Citations (52)
1