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Yee Wai Fung
Yee Wai Fung
Fillet (mechanics)
Delamination
Integrated circuit packaging
Soldering
Printed circuit board
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A Packaging Solution to Enable Moisture Sensitivity Level 1 Zero Delamination for Leaded Surface Mount Device Package
2020
EPTC | Electronics Packaging Technology Conference
Zhiwen Li
Shu Ming Yip
Yee Wai Fung
Haibin Chen
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