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Alicja Lesniewska

IMEC

5

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10

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Toward successful integration of gap-filling ultralow-k dielectrics

2016 IITC | International Interconnect Technology Conference
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Cobalt UBM for fine pitch microbump applications in 3DIC

2015 IITC | International Interconnect Technology Conference
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Optimized pore stuffing for enhanced compatibility with interconnect integration flow

2015 IITC | International Interconnect Technology Conference
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