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Hideki Ishii
Hideki Ishii
Renesas Electronics
Composite material
Materials science
Grain boundary diffusion coefficient
Whisker
Anisotropy
2
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2024
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Investigation of mechanism of corrosion resistance of Pd coated Cu wire joint by pseudo process
2019
ICEP | International Conference on Electronics Packaging
Shunsuke Nemoto
Takehiko Maeda
Masahiro Miyajima
Yasuhiko Akaike
Katsuhiko Kitagawa
Hideki Ishii
Haruo Shimamoto
Katsuya Kikuchi
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Prediction of tin-whiskers generation during thermal cycle test using stress and mass-diffusion analysis
2012
ECTC | Electronic Components and Technology Conference
Takeshi Terasaki
Takahiko Kato
Tomio Iwasaki
Yasutaka Ookura
Masato Nakamura
Hideki Ishii
Kenji Yamamoto
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