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Jinhan Cho
Jinhan Cho
Pohang University of Science and Technology
Composite material
Copper
Materials science
Copper oxide
Adhesion
1
Papers
13
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Effect of curing temperature on the adhesion strength of polyamideimide/ copper joints
1998
Journal of Adhesion Science and Technology
Jinhan Cho
D.I. Kong
Chibeom Park
M. Y. Jin
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Citations (13)
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