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Ronan Larger

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Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding

2014
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Metal-assisted hermetic wafer-level packaging

2014
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Étude en conductivité thermique du composé Sm[indice inférieur 2]CuO[indice inférieur 4] dopé au cérium

2005
- Ronan Larger
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