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Tomohiro Nishiyama

NEC

8

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18

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Electrical Design and Techniques for an Embedded High-Pin-Count LSI Chip Package

2011 IEEE Transactions on Components, Packaging and Manufacturing Technology
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A novel ultra-thin package for embedded high-pin-count LSI supported by Cu plate

2009 ECTC | Electronic Components and Technology Conference
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Development of CoC (Chip-on-Chip) Interconnection technology in hyperfine pitch : Packaging technology

2003 Nec Research & Development
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Electrode structure for the semiconductor device, and manufacturing processes and over apparatus

2002
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