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Se-ho You
Se-ho You
Samsung
Electronic engineering
Materials science
Embedded system
Electrical impedance
Engineering
4
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30
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Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
2018
ECTC | Electronic Components and Technology Conference
Se-ho You
Seonghwan Jeon
Dan Oh
KilSoo Kim
Jaechoon Kim
Seung-yong Cha
GyoungBum Kim
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Citations (16)
Package embedded decoupling capacitor impact on core power delivery network for ARM SoC application
2014
ECTC | Electronic Components and Technology Conference
GaWon Kim
Max Sunghwan Min
Melinda Ling Yang
Anil Gundurao
Eileen You
Harpreet Gill
Seung-yong Cha
Young-Hoon Kim
Se-ho You
Seungbae Lee
Woonghwan Ryu
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Citations (7)
Fast and direct coupled-micro strip interconnect reduced-order modeling based on the finite-element method
2006
IEEE Transactions on Microwave Theory and Techniques
Se-ho You
Edward F. Kuester
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Citations (6)
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