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Quentin Vandier
Quentin Vandier
Materials science
Composite material
Ceramic
Thermal expansion
Delamination
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Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package
2018
ECTC | Electronic Components and Technology Conference
Aurore Quelennec
Yosri Ayadi
Quentin Vandier
Eric Duchesne
Hélène Frémont
Dominique Drouin
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