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B. Njurnan
B. Njurnan
Structural engineering
Electronic engineering
Materials science
Delamination
Composite material
1
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Failure analysis of full delamination on the stacked die leaded packages
2003
ECTC | Electronic Components and Technology Conference
T.Y. Lin
Z.P. Xiong
Y.E. Yao
L. Tok
Z. Y. Yue
B. Njurnan
K.H Chua
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Citations (17)
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