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Dechun Lu
Dechun Lu
University of Electronic Science and Technology of China
Composite material
Electromigration
Alloy
Microstructure
Copper
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Investigation of electromigration in copper interconnection of ULSI
2008
ICEPT | International Conference on Electronic Packaging Technology
Dechun Lu
Shengxiang Bao
Lili Ma
Zhibo Du
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