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Kyouhei Mineo
Kyouhei Mineo
Electroplating
Thermal copper pillar bump
Through-silicon via
Pillar
Miniaturization
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Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging
2014
Koji Tatsumi
Kyouhei Mineo
Takeshi Hatta
Takuma Katase
Masayuki Ishikawa
Akihiro Masuda
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