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Kumarapuram Gopalakrishnan
Kumarapuram Gopalakrishnan
GlobalFoundries
Electronic engineering
Silicon
Engineering
Through-silicon via
Aspect ratio (aeronautics)
2
Papers
4
Citations
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Process development and optimization for high-aspect ratio through-silicon via (TSV) etch
2016
ASMC | Advanced Semiconductor Manufacturing Conference
Kumarapuram Gopalakrishnan
Anurag Peddaiahgari
Daniel Smith
Dingyou Zhang
Luke England
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Citations (3)
A New Type of TSV Defect Caused by BMD in Silicon Substrate
2014
Dingyou Zhang
Sarasvathi Thangaraju
Daniel Smith
Himani Kamineni
Christian Klewer
Mark Scholefield
Ming Lei
Tong Qing Chen
Kumarapuram Gopalakrishnan
Abhishek Vikram
Victor Lim
Wonwoo Kim
Ramakanth Alapati
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Citations (1)
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