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Chun-Yen Ting

5

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Antenna-on-package on low-cost organic substrate for 60 GHz wireless communication applications

2017 ICEPT | International Conference on Electronic Packaging Technology
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Millimeter-wave antenna in package on low-cost organic substrate for flip chip chip scale (FCCSP) package

2017 ICSJ | CPMT Symposium Japan
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Antenna array integrated on multilayer organic package for millimeter-wave applications

2016 EPTC | Electronics Packaging Technology Conference
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