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Seishi Oida
Seishi Oida
Composite material
Ball grid array
Materials science
Solder ball
2
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Joint Reliability of Sn-Zn BGA
2003
Journal of Japan Institute of Electronics Packaging
Kouji Omori
Seishi Oida
Masayuki Yukawa
Makoto Takeuchi
Kazuhisa Kanai
Shinya Kozono
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