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Guangjun Cui
Guangjun Cui
Quad Flat No-leads package
Quad Flat Package
Composite material
Electromagnetic compatibility
Integrated circuit design
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QFP plastic cavity carrier design for MPW chip package
2016
ICEPT | International Conference on Electronic Packaging Technology
Zhenchao Li
Qian Wang
Yu Chen
Guangjun Cui
Zhaolin Liu
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