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Dongjoo Park

Amkor Technology

6

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63

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Development of extremely thin profile flip chip CSP using laser assisted bonding technology

2017 ICSJ | CPMT Symposium Japan
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Board level reliability assessments of thru-mold via package on package (TMV™ PoP)

2009 ICEPT | International Conference on Electronic Packaging Technology
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Application of through mold via (TMV) as PoP base package

2008 ECTC | Electronic Components and Technology Conference
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Citations (43)