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Soon Ann Sek
Soon Ann Sek
Agency for Science, Technology and Research
Composite material
Materials science
Electronic engineering
Electronic packaging
Wafer-level packaging
4
Papers
18
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Through mold interconnects for fan-out wafer level package
2016
EPTC | Electronics Packaging Technology Conference
Soon Wee Ho
Leong Ching Wai
Soon Ann Sek
Daniel Ismael Cereno
Boon Long Lau
Hsiang-Yao Hsiao
Tai Chong Chai
Vempati Srinivasa Rao
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Citations (4)
Evaluation on multiple layer PBO-based Cu RDL process for Fan-Out Wafer Level Packaging (FOWLP)
2016
EPTC | Electronics Packaging Technology Conference
Soh Siew Boon
King Jien Chui
S. W. David Ho
Soon Ann Sek
Mingbin Yu
Prayudi Lianto
Yu Gu
Guan Huei See
Marvin L. Bernt
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Process and challenges of ultra-thick spin-on photoresist
2015
EPTC | Electronics Packaging Technology Conference
Soon Wee Ho
Soon Ann Sek
Boon Long Lau
Vempati Srinivasa Rao
Tai Chong Chai
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Citations (2)
Polymer-based fine pitch Cu RDL to enable cost-effective re-routing for 2.5D interposer and 3D-IC
2013
EPTC | Electronics Packaging Technology Conference
Soon Wee Ho
L. Ding
Song How Lim
Soon Ann Sek
Mingbin Yu
G. Q. Lo
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Citations (9)
1